Exablend® PPS GF30S — 30 % glass-filled polyphenylene sulfide, V-0, stable series

Description

Exablend® PPS GF30S is a polyphenylene sulfide (PPS) based compound reinforced with 30 % glass fiber. It belongs to the “S” series — grades with a low spread of values around the median and high batch-to-batch consistency. It is intended for series production with tight tolerances, where reproducibility of dimensions and mechanical properties from batch to batch is critical.

The semi-crystalline PPS matrix combined with 30 % glass fiber (content 30 ± 3 %) provides a flexural modulus of 11 000 MPa, a tensile strength of 150 MPa, heat resistance of HDT/A 262 °C per ISO 75-2 (1.82 MPa), a UL 94 V-0 flammability rating at 1/16 inch, and mold shrinkage of 0.2 % longitudinal and 0.4 % transverse — batch-to-batch CoV ≤ 5 % (the key characteristic of the S series). Its electrical insulation properties meet the requirements of power electronics and high-voltage connectors.

The chemical resistance of PPS to most solvents, acids and alkalis is retained; each specific environment requires verification with regard to temperature and contact time.

Key properties

• Polyphenylene sulfide reinforced with 30 % glass fiber (30 ± 3 %)
• “S” series — one of the Exablend® PPS technology lines
• Inherent flame retardancy, UL 94 V-0 at 1.6 mm without halogenated or phosphorus flame retardants — RoHS/REACH compliant out of the box
• High heat resistance: HDT/A 262 °C per ISO 75-2 (1.82 MPa), melting point 280 °C
• Flexural modulus 11 000 MPa, tensile modulus 10 000 MPa
• Flexural strength 230 MPa, tensile strength 150 MPa
• Notched Izod impact strength 11 kJ/m², unnotched 50 kJ/m²
• Electric strength 16 kV/mm, volume resistivity 5×10¹⁵ Ω·m
• Narrow shrinkage: 0.2 % longitudinal, 0.4 % transverse — batch-to-batch CoV ≤ 5 %
• High chemical resistance to many solvents, fuels, acids and alkalis; specific environments require verification

Applications

• Automotive connectors, sensors, thermostats, fuel pumps, ignition systems
• Precision gears, bushings, bearing housings, motor housings; overmolding onto metal inserts thanks to low shrinkage
• Electronic components for lead-free reflow soldering (up to 260 °C): SMD connectors, adapters, coils, board-mounted connectors
• Series-production parts with tight tolerances and batch reproducibility requirements
• Industrial pump parts, impellers and fittings in chemical environments
• High-voltage insulators and switchgear components

Processing recommendations

Injection molding. Melt temperature 280–320 °C, mold temperature 100–140 °C (injection 80–150 °C). Pre-drying: 4 hours at 120–140 °C to a residual moisture content of ≤0.2 %. To achieve the narrow property spread of the S series, follow the recommended processing window without exceeding the upper melt temperature limit.